APPLICATION OF THEORY OF HIERARCHICAL CELLULAR AUTOMATA ( CA ) FOR
TEST AND DIAGNOSIS OF MICROPROCESSORS
A RESEARCH PROJECT PROPOSAL
SUBMITTED TO
INTEL CORPORATION
SANTA CLARA CALIFORNIA USA
BY
PROF. P PAL CHAUDHURI ( CHIEF INVESTIGATOR )
DIRECTOR, SCHOOL OF INFORMATION TECHNOLOGY
BENGAL ENGINEERING COLLEGE ( DEEMED UNIVERSITY )
SIBPUR HOWRAH WEST- BENGAL
INDIA 711103
AND
DR. S SUR KOLAY ( CO-INVESTIGATOR )
INDIAN STATISTICAL INSTITUTE , CALCUTTA
EXECUTIVE SUMMARY - SALIENT FEATURES OF THE PROPOSAL
I BACKGROUND
1. SIGNIFICANTAMOUNT OFRESEARCH HAVEBEEN DONEAT IITKHARAGPUR
AND BENGALENGINEERING COLLEGE( DEEMED UNIVERSITY)INTHE FIELD
OF THEORYAND APPLICATIONOF CELLAUTOMATA FORTESTINGVLSI
CIRCUITS.
2. SOME OF THE RESULTS OF THIS RESEARCH WORK HAVE BEEN REPORTED IN
THE BOOK AUTHORED BY P PAL CHAUDHURI AND HIS RESEARCH STUDENTS
" ADDITIVE CELLULAR AUTOMATA THEORY AND APPLICATIONS VOLUME 1 "
IEEE COMPUTER SOCIETY PRESS PUBLICATION, 1997. SUBSEQUENTLY, DURING
3. IN THE ABOVE BACKGROUND THE CURRENT RESEARCH PROJECT PROPOSAL
SPECIFICALLY TARGETS :
APPLICATION OF HIERARCHICAL CELLULAR AUTOMATA (CA) THEORY
FOR TEST AND DIAGNOSIS OF THE SPECIFIC CLASS OF VLSI
CIRCUITS CONVENTIONALLY REFERRED TO AS MICROPROCESSORS.
HANDLING MICROPROCESSOR CIRCUITS DEMAND SPECIAL TREATMENT
THAT WOULD BE TOTALLY DIFFERENT FROM THAT EMPLOYED FOR
TESTING GENERAL VLSI CIRCUITS OR CORES.
II DELIVERABLES
1. FIRST YEAR :
A GENERAL METHODOLOGY FOR APPLICATION OF HIERARCHICAL CA
THEORY FOR TESTING AN EXPERIMENTAL MICROPROCESSOR CIRCUIT.
THE PROOF OF THE CONCEPT WILL BE DEMONSTRATED BY THE END OF
FIRST YEAR FOR STUCK-AT-FAULT MODEL.
A GENARILISED CAD PACKAGE FOR TESTING A MICROPROCESSOR CIRCUIT
WITH INDICATION OF FAULT ( BOTH STUCK-AT AND DELAY FAULTS )
COVERAGE ALONG WITH AREA OVERHEAD AND PERFORMANCE PENALTY.
THE PACKAGE WILL PROVIDE ALTERNATIVE SOLUTIONS TO MEET THE
SPECIFIC REQUIREMENTS OF THE DESIGNERS IN TERMS OF TARGETED
FAULT COVERAGE AND OVERHEADS.
A METHODOLOGY FOR DIAGNOSIS - BOTH DESIGN AND SILICON
DEBUG – BASED ON THE HIERARCHICAL CABIST STRUCTURE EMBEDED
ON THE MICROPROCESSOR CIRCUIT.
NOTE : IF THE PROJECT IS INITIATED ON JANUARY 2000, THE
PROTOTYPE CAD PACKAGE WILL BE HANDED OVER TO INTEL
BY 2001 FOR EXPERIMENTATION ON REAL LIFE DESIGNS. BASED
ON FEEDBACK FROM INTEL DESIGNERS THE PACKAGE WILL BE
REFINED ON THE THIRD YEAR OF THE PROJECT - THE YEAR
2002.
III MODALITIES OF INTERACTION
FOR SUCCESSFUL IMPLEMENTATION OF THE PROJET IT IS DESIRABLE THAT :
THERE IS CONTINUOUS INTERACTION OF INTEL DESIGNERS WITH THE
RESEARCH TEAM WORKING UNDER PROF. P PAL CHAUDHURI AT BENGAL
ENGINEERING COLLEGE ( DEEMED UNIVERSITY ) THROUGH EMAIL, FAX,
TELECONFERENCE, AND ACROSS - THE - TABLE DISCUSSIONS WITH AN
AVERAGE FREQUENCE OF TWO/THREE TIMES IN A YEAR.
THIS MODALITY HAVE BEEN SUCCESSFULLY FOLLOWED IN RESPECT
OF THE FIRST RESEARCH PROJECT ( ON ASYNCHRONOUS CIRCUIT
TESTING ) SPONSORED BY INTEL IN NOV.,1997 AND ALSO FOR
RESEARCH PROJECTS FUNDED BY OTHER MULTINATIONAL COMPANIES
OF NORTH AMERICA TO PROF. P PAL CHAUDHURI AT BENGAL
ENGINEERING COLLEGE ( DEEMED UNIVERSITY ).
I INTRODUCTION
1.1 IN THE ERA OF DEEP SUB-MICROON TECHNOLOGY, THE EXISTING TEST
SOLUTIONS BUILT AROUND FULL/PARTIAL SCAN ( OR FUNCTIONAL TESTING )
WILL NOT BE COST EFFECTIVE FOR TESTING A LARGE SCALE
MICROPROCESSOR CIRCUIT.
GENERAL METHODOLOGY FOR INSERTION OF BIST STRUCTURE IN A GENERAL
MICROPROCESSOR CIRCUIT. THE RESULTS REPORTED IN THE PUBLISHED
LITERATURE ARE MOSTLY AD -HOC IN NATURE.
1.4 IN THE ABOVE CONTEXT THIS PROJECT PROPOSAL HAS BEEN FORMULATED
TO SOLVE THE PROBLEM OF TESTING MICROPROCESSORS BASED ON THE
BACKGROUND PREPARATION REPORTED IN THE NEXT SECTION.
II BACKGROUND PREPARATION
2.1 SIGNIFACANT AMOUNT OF RESEARCH WORK IN THE FIELD OF CELLULAR
AUTOMATA ( CA ) HAVE BEEN CONDUCTED BY THE RESEARCH GROUP HEADED
BY PROF. P PAL CHAUDHURI AT INDIAN INSTITUTE OF TECHNOLOGY
KHARAGPUR INDIA DURING 1988 TO 1996 AND SUBSEQUENTLY AT
BENGAL ENGINEERING COLLEGE ( DEEMED UNIVERSITY ).
SOME OF THESE RESEARCH RESULTS ARE REPORTED IN THE BOOK ENTITLED
" ADDITIVE CELLULAR AUTOMATA THEORY AND APPLICATIONS VOL 1 "
IEEE COMPUTER SOCIETY PRESS PUBLICATION, 1997.
2.2 THE PROOF OF THE CA THEORY EMPLOYED AS A CABIST ( CA BASED BUILT-
IN-SELF-TEST) STRUCTURE FOR TESTING VLSI CIRCUITS HAVE BEEN
DEMONSTRATED IN MID 90’S ON BENCHMARK CIRCUITS AND ALSO ON SOME
INDUSTRIAL DESIGNS.
2.3 AS A VISITING FACULTY AT STRATEGIC CAD LAB ( SCL ) INTEL CORPORATION
PORTLAND , IN 1997 PROF. P PAL CHAUDHURI DEMONSTRATED THE
APPLICATION OF THE CABIST THEORY FOR TEST SOLUTION OF THE
EXPERIMENTAL ASYNCHRONOUS CIRCUIT - THE RAPPID CHIP DESIGNED BY
THE INTEL RESEARCH TEAM.
2.4 SINCE 1998 PROF. P PAL CHAUDHURI AND DR. SUSMITA SUR KOLAY HAVE
BEEN DEVELOPING A PACKAGE FOR
" ENHANCING TESTABILITY OF ASYNCHRONOUS CIRCUITS "
THROUGH INSERTION OF CABIST STRUCTURE IN AN ASYNCHRONOUS CIRCUIT.
THIS WORK IS BEING CARRIED OUT UNDER THE RESEARCH GRANT FUNDED
BY INTEL CORPORATION, USA FOR THREE YEARS ( 1998 – 2000
).
2.3 THE WORK ON HIERARCHIAL CA STRUCTURE BUILT AROUND THE THEORY
OF EXTENSION FIELD WAS INITIATED AT IIT KHARAGPUR DURING 1995-96.
SUBSEQUENTLY, THE COMPLETE THEORY OF THE HIERARCHICAL CA
( REFERRED TO AS GF (2**P)**Q) CA ) HAVE BEEN DEVELOPED AT B E
COLLEGE (DEEMED UNIVERSITY) THROUGH TWO PH.D THESIS WORK.
2.4 THE THEORY DEVELOPED UNDER THE PH.D WORK AT B E COLLEGE ON
HIERARCHICAL CA ( AS REPORTED IN THE VLSI 2000 CONFERENCE PAPER )
HAS BEEN APPLIED FOR TESTING VLSI CIRCUITS.
WITH THE ABOVE BACKGROUND PREPARATION, THE THEORY
OF HIERARCHICAL CA WILL BE APPLIED FOR TEST SOLUTION OF
MICROPROCESSORS AS ELABORATED IN THE NEXT SECTION.
III THE PROJECT OUTLINE
3.1 A PROTOTYPE CAD PACKAGE ( NAMED AS A CABISTMP - CELLULAR
AUTOMATA based BUILT - IN - SELF - TEST for MICROPROCESSORS ) WILL
BE DEVELOPED UNDER THIS PROJECT.
3.2 THE INPUTS (OUTPUTS) TO (FROM) THE PACKAGE ARE :
1. INPUTS : HIERARCHICAL STRUCTURAL AND FUNCTIONAL
DESCRIPTION OF THE MICRPOPROCESSOR CIRCUIT AS
NETLIST OF GATES, AND A NETLIST OF RTL/
FUNCTIONAL MODULES.
2. OUTPUTS : BIST-ED MICROPROCESSOR WITH THE INDICATION OF
THE PERCENTAGE FAULT COVERAGE , AREA
OVERHEAD, AND PERFORMANCE PENALTY.
3.3 THE METHODOLOGY TO EMBED HIERARCHICAL CABIST STRUCTURE
1. BASED ON THE INPUT HIERARCHICAL FUNCTIONAL/STRUCTURAL
DESCRIPTION , THE CIRCUIT WILL BE FUNCTIONALY
PARTITIONED TO ARRIVE AT DIFFERENT ECONOMICALLY BIST
- ABLE MODULES. AN EFFICIENT FUNCTIONAL PARTITIONING
ALGORITHM WILL BE DEVELOPED SPICIFICALLY TO HANDLE
LARGE SCALE MICROPROCESSOR CIRCUITS.
2. CABIST STRUCTURE WILL BE DESIGNED FOR EACH MODULE
BASED ON THE THEORY DEVELOPED FOR ANALYSIS OF
THE HIERARCHICAL CA AND THE FUNCTIONALITY EMBEDED
IN THE MODULE.
3. A HIERARCHICAL CABIST STRUCTURE WILL BE FINALLY
DESIGNED WHILE COMBINING THE BIST STRUCTURES EMBEDED
FOR EACH MODULE.
IDENTIFIED THROUGH FAULT SIMULATION, AND ALSO
OVERHEADS INCURRED WILL BE ESTIMATED.
5. ITERATIONS ON STEPS 1 TO 4 WILL BE TRIED TILL DESIRED
FIGURES OF FAULT COVERAGE, AREA OVERHEAD ETC. ARE
REALIZED IN STEP 4.
IV EXECUTION SCHEDULE
THE PROJECT TASKS WILL BE IMPLEMENTED AS PER THE FOLLOWING
SCHEDULE.
4.1 FIRST YEAR
DELIVERABLES FROM BEC : THE METHODOLOGY TO EMBED THE
CABIST STRUCTURE ON A
MICROPROCESSOR AND THE
DEMONSTARTION OF THE SCHEME ON
A MICROPROCESSOR TO BE SUPPLIED
BY INTEL.
COMMITMENT FROM INTEL : SUPPLY OF THE HIERARCHICAL
STRUCTURAL/FUNCTIONAL
DESCRIPTION OF A MICROPROCESSOR
WITH NETLIST AT RTL/FUNCTIONAL
LEVEL AND GATE LEVEL.
P 10
CABIST STRUCTURE ON A
MICROPROCESSOR ALONG WITH THE
INDICATION OF FAULT COVERAGE
AREA OVERHEAD, AND PERFORMANCE
PENALTY.
COMMITMENT FROM INTEL : (1) DELIVERY OF SECOND
MICROPROCESSOR CIRCUIT TO BEC
FOR EXHAUSTIVE TESTING OF THE
PACKAGE.
4.3 THIRD YEAR
DELIVERABLES FROM BEC : THE REFINED PACKAGE BASED ON
THE FEEDBACK FROM INTEL
DESIGNERS.
DIAGNOSIS METHODOLGY FOR
DESIGN DEBUG AND SILICON DEBUG.
COMMITMENT FROM INTEL ; THOROUGH TESTING AND FEEDBACK
ALONG WITH CONTINUOUS
INTERACTION WITH THE BEC TEAM.
V THE BUDGET
(I) FUND OF US $ 50, 000 WILL BE RELEASED BY INTEL CORPORATION
IN THE BEGINNING OF EACH YEAR TO MEET THE PROJECT
EXPENSES FOR PURCHASE OF EQUIPMENTS , SALARY FOR THE
RESEARCH STAFFS/STUDENTS AND OTHER MISCELLENEOUS
HEADS.
TOTAL AMOUNT FOR THREE YEARS : $ 1 50, 000
NOTE : PROVISION SHOULD BE ALSO KEPT FOR THE FOLLOWING
EXPENSES -
(II) VISIT OF BEC TEAM MEMBERS TO INTEL SANTA CLARA OFFICE
FOR INTERACTION WITH INTEL DESIGNERS - TRAVEL AND
HOTEL EXPENSES - TWO VISITS PER YEAR FOR TWO PROJECT
STAFFS.
CLARA OFFICE TO INTERACT WITH INTEL DESIGNERS - ON THE
AVERAGE 4 MAN MONTHS PER YEAR. FROM SECOND YEAR OF
THE PROJECT.
VI BIODATA OF INVESTIGATORS
ADDRESS : DEPARTMENT OF COMPUTER SCIENCE AND TECHNOLOGY
BENGAL ENGINEERING COLLEGE ( DEEMED UNIVERSITY )
SIBPUR, HOWRAH 711103
WEST-BENGAL, INDIA
EXPERIENCE :
PROFESSIONAL EXPERIENCE : IBM WORLD TRADE CORPN. (
1963-75 )
TEACHING AND RESEARCH : IIT KHARAGPUR ( 1975 – 96 )
BENGAL ENGINEERING COLLEGE ( 1998 - )
VISITING FACULTY ( UNIVERSITY OF
ILLINOIS, URBANA CHAMPAINGE) - 1991,
AND INTEL RESEARCH LABS, PORTLAND ,
USA – 1997.
P 14
PUBLICATION : MORE THAN 100 RESEARCH PAPERS IN
INTERNATIONAL JOURNALS AND
CONFERENCE PROCEEDINGS.
TWO BOOKS - (1) THE BOOK ON
CELLULAR AUTOMATA PUBLISHED BY
IEEE COMPUTER SOCIETY PRESS, USA IN
INDIA – THE FIRST EDITION IN 1994,AND SECOND EDITION
IN 1998.
MAJOR RESEARCH CONTRIBUTION :
DEVELOPED THE THEORY OF CELLULAR AUTOMATA AND ITS APPLICATIONS
IN DIVERSE FIELDS -
VLSI TESTING AND DESIGN, DESIGN OF ERROR CORRECTING CODES, DATA
ENCRYPTION, DATA COMPRESSION, MODELLING PHYSICAL SYSTEMS
ETC.